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BU280Z-178-HT| CONN IC DIP SOCKET 28POS GOLD
在线报价一
属性
| Contact Finish - Mating | Gold |
|---|---|
| Contact Finish - Post | Copper |
| Contact Finish Thickness - Mating | 78.7µin (2.00µm) |
| Contact Finish Thickness - Post | Flash |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Open Frame |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Operating Temperature | -55°C ~ 125°C |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
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