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在线报价一
属性
| Contact Finish - Mating | Tin-Lead |
|---|---|
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Mating | 200µin (5.08µm) |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Open Frame |
| Housing Material | Polyethersulfone (PES), Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 100 (4 x 25) |
| Operating Temperature | 0°C ~ 105°C |
| Pitch - Mating | - |
| Pitch - Post | - |
| Termination | Solder |
| Type | QFP |
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