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ED08DT| CONN IC DIP SOCKET 8POS TIN
在线报价一
属性
| Contact Finish - Mating | Tin |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 60µin (1.52µm) |
| Contact Finish Thickness - Post | 60µin (1.52µm) |
| Contact Material - Mating | Phosphor Bronze |
| Contact Material - Post | Phosphor Bronze |
| Features | Open Frame |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Operating Temperature | -55°C ~ 110°C |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
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